Solder paste ProFlow issue
That helps to a point.  (about 25 deg C)  After that, I can't reduce the pressure enough.  On the flip side, when it is cool - 20 deg C, I can't increase the pressure enough - the paste it too hard.
-----Original Message-----
From: Higgins Leo [mailto:[log in to unmask]]
Sent: Thursday, September 26, 2002 11:34 PM
To: [log in to unmask]; [log in to unmask]
Subject: Solder paste ProFlow issue

Does the problem reduce if you print with less shear stress (reduced pressure, lower head speed) on the DEK?  Shear-thinning in the paste could add to the lower viscosity problems caused by elevated temperature.

Leo

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