Jim, It is a gasketed head that fits right down on the stencil and delivers the solder paste directly to the stencil, with no bulk exposure to the air of the paste inside the stencil machine until the paste is printed. Both DEK and MPM offer this type of system. Proflow is one of the trademarked names. All the major paste suppliers provide paste in compatible containers. Bev Christian Research in Motion -----Original Message----- From: Marsico, James [mailto:[log in to unmask]] Sent: September 26, 2002 7:24 AM To: [log in to unmask] Subject: Re: [TN] Viscosity vs Temperature. Sorry... no solutions or recommendations, just a question. I'm not familiar with Proflow, could someone explain? Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> 631-595-5879 -----Original Message----- From: Jowan Iven [SMTP:[log in to unmask]] Sent: Thursday, September 26, 2002 1:26 AM To: [log in to unmask] Subject: Re: [TN] Viscosity vs Temperature. Hi Henry! I've run into similar problems with the proflow system. We also had very good results with normal squeegees and poor results with proflow. I started a "Design of Experiment" to figure out what the reason could be. Very interesting data came out of the test , but not a solution. One very important parameter was deliberately not included in the test. The solderpaste. I just wanted the system to work with our standard solderpaste. When the conclusion was that our standard solderpaste failed in the proflowsystem, I started additional test with other pastes (types and brands). The results look very promising for now. Several pastemanufacturers are capable in producing a solderpaste that works well with Proflow. Contact your current supplier and you will probably find a solution together. Best regards, Jowan Iven Process Engineer Dept. Engineering & Technology Stork Electronics BV -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Henry Rekers ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------