Depending on access to the repair site, mini stencils can be a royal pain, the extra solder paste isn't necessary to place a BGA anyway, and yes, IMHO, the risk of solder bridging is increased. Peter Peter Lee <[log in to unmask]> 10/09/2002 10:34 PM Sent by: TechNet <[log in to unmask]> Please respond to "TechNet E-Mail Forum."; Please respond to Peter Lee To: [log in to unmask] cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group) Subject: Re: [TN] BGA rework - excessive collapsing What would be the impact of using mini-stencil to paste the board for BGA rework? Would it increase the chance of bridging or minimize it through increased clearance and solder volume? Rgds, Peter -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Earl Moon Sent: Monday, September 09, 2002 4:53 PM To: [log in to unmask] Subject: Re: [TN] BGA rework - excessive collapsing With respect to PCB heating, some rework stations do a pretty good job of preheating the board when the profile is carefully planned and used. With that, the board most often is not subject to warpage as you speak. Earl ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- [This e-mail is confidential and may also be privileged. If you are not the intended recipient, please delete it and notify us immediately; you should not copy or use it for any purpose, nor disclose its contents to any other person. Thank you.] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------