The
following IPC products have now been released. To place your
order Monday-Friday from 9:00 am to 5:00 pm, contact IPC's customer service
department at 847-790-5362, or via e-mail at [log in to unmask].
· IPC-9850; Surface Mount Placement Equipment Characterization -
Kit
· IPC-J-STD-020B; Moisture/Reflow
Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices
· IPC-CC-830B; Qualification
and Performance of Electrical Insulating Compound for Printed Wiring
Assemblies
· IPC-J-STD-033A; Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount
Devices
IPC-9850; Surface Mount Placement Equipment Characterization -
Kit
This standard has been developed to standardize the parameters,
measurement procedures, and the methodologies used for the specification,
evaluation, and continuing verification of assembly equipment characterization
parameters. It establishes the procedures to characterize and document machine
placement capability of surface mount assembly equipment while maintaining a
placement accuracy to placement speed relationship. Kit includes one printed
copy of the standard and a CD with the support spreadsheet, forms and the
drawing files (Gerber format) necessary to make the test materials. (This CD is an exception to IPC's standard
single user license and the material may be printed from the CD.) 60 Pages. Released July
2002.
To
order online, click here.
Kit: Hard Copy &
CD
Member Price:
$35.00 Non-Member Price: $70.00
IPC-J-STD-020B;
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices
Updated & ANSI
Approved! This standard identifies the classification level of nonhermetic
solid state surface mount devices that are sensitive to moisture-induced stress.
This standard now covers components to be processed at higher temperatures for
lead-free assembly. It is used to determine what classification level should be
used for initial reliability qualification. These devices can be properly
packaged, stored, and handled to avoid subsequent thermal/mechanical damage
during solder reflow attachment and/or repair operation. Developed by IPC and
JEDEC. 12 pages. Released July 2002. To order online, click here.
Hard Copy
Member Price: $20.00 Non-Member Price: $40.00
CD or Download
Member
Price: $30.00 Non-Member Price: $60.00
IPC-CC-830B; Qualification and
Performance of Electrical Insulating Compound for Printed Wiring
Assemblies
Updated! This is the industry standard for qualification and
quality conformance of conformal coating. Its intent is to show how to obtain
maximum information with minimum test redundancy. Includes requirements and
evaluations of material properties using standardized test vehicles. Revision B
updates include sample reports to document qualification, retention and
conformance inspection. 18 pages. Released August
2002. To order online, click here.
Hard Copy
Member Price: $15.00 Non-Member Price: $30.00
CD or Download
Member
Price: $23.00 Non-Member Price: $46.00
IPC-J-STD-033A; Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive Surface Mount
Devices
Updated
& ANSI Approved! Provides Surface Mount Device
manufacturers and users with standardized methods for handling, packing,
shipping and use of moisture/reflow sensitive SMDs. These methods help avoid
damage from moisture absorption and exposure to solder reflow temperatures that
can result in yield and reliability degradation. By using these procedures, safe
and damage-free reflow can be achieved with the dry packing process, providing a
minimum shelf life of 12 months from the seal date when using sealed dry
bags.Developed by IPC and JEDEC. 12 pages. Released July 2002. To order online,
click here.
Hard Copy
Member Price: $20.00 Non-Member Price: $40.00
CD or Download
Member
Price: $30.00 Non-Member Price: $60.00
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