The following IPC products have now been released.  To place your order Monday-Friday from 9:00 am to 5:00 pm, contact IPC's customer service department at 847-790-5362, or via e-mail at [log in to unmask].
 
· IPC-9850; Surface Mount Placement Equipment Characterization - Kit
· IPC-J-STD-020B; Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
· IPC-CC-830B; Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
· IPC-J-STD-033A; Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
 
 
IPC-9850; Surface Mount Placement Equipment Characterization - Kit
This standard has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment characterization parameters. It establishes the procedures to characterize and document machine placement capability of surface mount assembly equipment while maintaining a placement accuracy to placement speed relationship. Kit includes one printed copy of the standard and a CD with the support spreadsheet, forms and the drawing files (Gerber format) necessary to make the test materials. (This CD is an exception to IPC's standard single user license and the material may be printed from the CD.)  60 Pages. Released July 2002.  To order online, click here.
 
  Kit: Hard Copy & CD  
  Member Price:   $35.00       Non-Member Price:  $70.00
 
 
IPC-J-STD-020B; Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
Updated & ANSI Approved!  This standard identifies the classification level of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. This standard now covers components to be processed at higher temperatures for lead-free assembly. It is used to determine what classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment and/or repair operation. Developed by IPC and JEDEC. 12 pages. Released July 2002.  To order online, click here.
 
Hard Copy
  Member Price:   $20.00         Non-Member Price:  $40.00 
CD or Download
  Member Price:   $30.00         Non-Member Price:  $60.00 
 
 
IPC-CC-830B; Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
Updated!  This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Revision B updates include sample reports to document qualification, retention and conformance inspection. 18 pages. Released August 2002.  To order online, click here.
 
Hard Copy
  Member Price:   $15.00         Non-Member Price:  $30.00
CD or Download
  Member Price:   $23.00         Non-Member Price:  $46.00
 
 
IPC-J-STD-033A; Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Updated & ANSI Approved!  Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags.Developed by IPC and JEDEC. 12 pages. Released July 2002.  To order online, click here.
 
Hard Copy
  Member Price:   $20.00         Non-Member Price:  $40.00
CD or Download
  Member Price:   $30.00         Non-Member Price:  $60.00
 
To place your order Monday-Friday from 9:00 am to 5:00 pm, contact IPC's customer service department at 847-790-5362, or via e-mail at [log in to unmask].
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