Why
doesn't the IPC offer counseling to members missing Earl - that seems fitting
with today's politically correct world - c'mon, get over it.
Hate to say it, but Earl Moon went
through all this stuff when dealing with some parts from Texas
Instruments...
As the saying goes; "You don't know what you miss until
it's (he's) gone..."
-Steve Gregory-
Technet,
If I may continue my question on BGA rework
process:
Recently we have seen intermitted failures from a few BGA
assemblies.
After removing the suspicious BGA on the rework station we
noticed
dewetting on a majority number of pads of the removed BGA. The
solder
ball residues were mostly attaching to the board.
Has
anyone seen this before? How likely can this be caused by a
non-optimum
rework removal profile Is baking of the board normal prior
to rework
(removal/re-placement)?
We are tackling this issue from the part
supplier side and looking at
performing destructive X-ray analysis. Can
someone give me an idea of
what the ball attachment process is on the
BGA?
Rgds,
Peter
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