I'm outside the world of round robin testing - most of the time. Therefore, I do have a question. Going back many years, we in the MLB business had ILS problems but didn't call it that. We knew, that when using very resin rich materials, certain forces were exerted diagonally to the trace/pad to conductor interface casuing cracking or separation. Most of what I talk about today is imposing requirements using more moderate glass styles and corresponding resin contents. I do this in all my designs at all the places I work. Again, my Table II talks to this and points clearly to 2113 and 2116 glass styles with very well balanced resin contents as percentages resin to glass ratios. I talked about my Asian experiences and their total lack of using, or even knowing about, 2113/2313 glass styles. This has interested and somewhat surprised me for a couple of years but not as surprising as recent discoveries netotiating with emerging (new generation I call them) board shops. The teleconferences and emails have yielded some progress. I just received compliance in two MLB constructionw wherein the shops in question now are willing to work, even though without 2113, with highly resin rich types (1080 as one example) "surrounding" very resin poor materials (7628 as one example with the other being 1506) to achieve the same overall board thickness and individual dielectric thickness to achieve all physical and electrical objectives. I consider this a breakthrough even though I and several board shops in this country have been doing this for years but with an advangage of having 2113 materials to work with. Also, using these materials in combination, according to my Table II and other requirements in my book, we have maximized dimensional stability in all axes including those forces in the diagonal. Therefore, we have minimized ILS according to the thousands of x-sections I have - before and after thermal stress. I certainly would like to know how these designs and boards would hold up under the electrical stress testing so far discussed. Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------