I think what victor referring was the die attach solder fillet (with respect to the thickness of the die). I think bondline thickness of the die attach should be a range of 1-1.5 mils (with less than 10 % voids over the die area). The fillet of the solder should not be more than 50% of the die thickness. Some Die attach machines can achieve ±2 mils placement tolerance. Some Customers require that tolerance for SMT. regards JONOQs Earl Moon <[log in to unmask] To: [log in to unmask] M> cc: Sent by: TechNet Subject: Re: [TN] Die attach/bonding material <[log in to unmask]> 08/28/02 03:44 AM Please respond to "TechNet E-Mail Forum."; Please respond to Earl Moon Victor, I'm not posting this to embarass you but to point out how much your are doing and why: Victor, I mean this in a very complimentary way. How do you do so much? I mean are you the only one left like you at Dell doing this stuff all the way from chip level stuff design through customer acceptance. I really admire all you do and all the questions you ask. For this particular question, I yield to more knowledgeable die attach and wire bonding technology experts though I have done a bunch of it, I'm just not current. Also, I don't completely understand the questio relative to how far up the thickness of the die can the bonding material cover. ISHM, or whatever it is now called - just can't remember at the moment, should have many answers to your questions as would some semiconductor forume. Regards, Earl MoonMan Victor, I hope you receive more responses too. Thanks for the insight. Since your first postings I couldn't figure out what you were doing, especiall with Dell. Now I get it. Having spent another life with IBM, I can only imaging how you can help Dell even if a bit after the fact. F/A is fun especially when findings get routed back to designs. Hell, I might even buy a big black box now knowing what your doing. Sorry I could not have been any real help. I have lots of die attach and wire bond experience but haven't used it in some time. I know you will find your answers. Enjoy, Earl I am here not by choice but after Big Blue/Multek_Austin went belly up. This is the closes to an FA Lab that I will get a chance to used my skills after many years of practice. In the previous years I did the cross section and gave the findings to an engineer who wrote the report. Now I have to do all the wrap up. That I why I don't recall the reference requirements. I known it exists some where's. We all have to make a living till we quite paying taxes and add iron to the earth. victor, Victor, You're one hard woking guy. The experience you are gaining now will take you far probably without adding ferrous metals to the eart's much too shallow crust. I think you have some time to go for that. Keep up the great work and let us know some of it turns out. Hell, write a book - when you find time. Earl I have followed this gentleman's post for some time. I am impressed at the knowledge this many is trying to attain and, for all the right reasons, use it. I'm impressed and tired just trying to keep up MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------