Technet, One of our customers is requesting 75% solder fillet height on all the SMT Porcelain capacitors (0805 package size with taller profile) used for a RF application. We told them based on our experience that the excess paste volume (and wetting) can not be achieved by our SMT stencil process. IPC only requires 25% for class 2 products. But they are now specifying hand soldering these components. Can anyone see any reason for doing this? I am prepared to go back to our customer to convince them otherwise (reasons such as extra labour, process inefficiency, solder joint reliability etc.) Rgds, Peter --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------