Unbelievable as this may seem they look as if they were dropped or something was dropped on them!!!

David A. Douthit
Manager
LoCan LLC

Steve Gregory wrote:

Got some more results from failure analysis. Went to level 2 on one of the parts that looked okay with x-ray and found this...again go to:

http://www.stevezeva.homestead.com

and look at "Chipped Chips 1-4"...

We sure as hell didn't cause this...and as far as Phil's comment about a ESD event causing the broken wire bonds, it was the opinion of a gentleman at the failure analysis lab, that yes, broken wire bonds can be caused by ESD, but the board would need to be struck by a lightning bolt basically, to cause that kind of severe damage.

My big question is; how in the hell does this CRAP get into the market?

We're spending more than a few dollars getting this failure analysis done...I wonder how many companies would spend the money to do this? Or just go ahead and rework these failed devices?

I'll tell you, this REALLY sucks...I think most of you can appreciate the time that we now have to spend reworking, cleaning, re-inspecting, and then re-testing the assemblies that these parts are used on...

-Steve Gregory-

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