Steve,

Unbelievable as this may seem they look as if they were dropped or
something was dropped on them!!!

David A. Douthit
Manager
LoCan LLC

Steve Gregory wrote:

> Got some more results from failure analysis. Went to level 2 on one of
> the parts that looked okay with x-ray and found this...again go to:
>
> http://www.stevezeva.homestead.com
>
> and look at "Chipped Chips 1-4"...
>
> We sure as hell didn't cause this...and as far as Phil's comment about
> a ESD event causing the broken wire bonds, it was the opinion of a
> gentleman at the failure analysis lab, that yes, broken wire bonds can
> be caused by ESD, but the board would need to be struck by a lightning
> bolt basically, to cause that kind of severe damage.
>
> My big question is; how in the hell does this CRAP get into the
> market?
>
> We're spending more than a few dollars getting this failure analysis
> done...I wonder how many companies would spend the money to do this?
> Or just go ahead and rework these failed devices?
>
> I'll tell you, this REALLY sucks...I think most of you can appreciate
> the time that we now have to spend reworking, cleaning, re-inspecting,
> and then re-testing the assemblies that these parts are used on...
>
> -Steve Gregory-
>
>
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