Fellow TechNetters, Requesting for Pro and Cons on the following Connector Surface Plated finish; 1.) Base material/Ni/Au - Ni is > 250 micro inches and hard Au 30 micro inches 2). Base material/Ni/PdNi/FLASH Au - Gold FLASH over Pd/Ni ( 30 micro inches Min. over Ni 50 micro inches Min. Os the robustness of this two application the same . I welcome all comments and publication on process #2. Victor G. Hernandez Component/Material Failure Analysis Eng. PS4-1, Rm. 132 Ofc: 512-725-3471 Pgr: 512-907-0005 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------