Hi Peter, You write: >One of our customers is requesting 75% solder fillet height on all the >SMT Porcelain capacitors (0805 package size with taller profile) used >for a RF application. We told them based on our experience that the >excess paste volume (and wetting) can not be achieved by our SMT stencil >process. IPC only requires 25% for class 2 products. But they are now >specifying hand soldering these components. >Can anyone see any reason for doing this? I am prepared to go back to >our customer to convince them otherwise (reasons such as extra labour, >process inefficiency, solder joint reliability etc.) A: There may be some RF reason. However, every other indication is negative. There is no SJ reliability gain. You may crack the CCs both because of the uncontrolled manual soldering process and the stresses on the CC body from the larger solder masses. And, of course, there is the added expense. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Fax: 386-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------