I don't see how the manufacturer could win. The part with missing bonds doesn't show that there were bonds before in the location with missing bonds, and the gap in the broken bonds is too large to be induced  by the assembly or ICT process. I suppose that the x-ray was taken before decapsulation.
The only thing they could say is about the cracks- which can be seen only after decapsulation, and may be induced during this process. But I am sure that your failure analysis lab people are fair enough to have told you that if it happened.
Gaby
  ----- Original Message -----
  From: Steve Gregory
  To: [log in to unmask]
  Sent: Thursday, August 29, 2002 5:20 AM
  Subject: Re: [TN] MUX Failures...an update to the last update


  So Earl,

  We all see that, how do you address this problem with the OEM? I ask that question subjectively...

  You have to know that we've already done that, and we're being blamed for handling....hehehe.

  This is the "Kobiashu Maru" scenario that I spoke of earlier. This is a no-win scenario. On Semiconductor will have all their legal staff (which is more substantial than most of us ever have) to support their position that their parts are okay...so we have to deal with it. We'll eat all the costs that we will incur from their sub-standard processes and won't be able to do anything about it...

  As a note, comparible Fairchild MUX's work GREAT!!!

  (that's been backed-up by test data...)

  -Steve Gregory-

  In a message dated 8/28/2002 7:56:33 PM Central Daylight Time, [log in to unmask] writes:



    again, possible wire bond crash and burn. something's amiss in the process.

    MoonMan



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