I too hear you loud and clear. Still confusion greatly abounds as to how to specifiy a "simple" cleanliness requirement either in the master or assembly drawing notes - or in another part of the contract. I can only imagine the immersion time would be very long to effect the Bromines to "rise to the top." Bromines, as we all know and you have stated are THE FIRE RETARDANT element in all PCB's meeting UL registration, not certification requirements. The little Bromine elements also are a detriment to lamination integrity. Though relatively neutral, they comprise 20% of the entire resin system. Another bag of worms, Eh? MoonMan back from being Jarl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------