TechNetters, I would appreciate any advice you can give on how I should test these things for solderability. They are BIG (relative to SOIC20's or 0402's) and have a high thermal mass. We have tried using a globule block and a solder bath with different physical orientations, dips times, etc., but have not been able to come up with a good set of parameters for doing this. Any suggestions, short of the old "dip and look" of the mil standard? regards, Bev Christian Research in Motion --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------