Hello to All,
We are having Non Soldering problems in a QFP208 (Pitch is 0.5 mm or 20 mils)
The problem is focused in one area of the component.
We already checked the reflow profile and Solder paste printing and both are OK.
We realized that the components have coplanarity in the area with failures.
What is the maximum coplanarity accepted for this type of components?
Thanks,
Alejandro Becerra
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