Sent: Wednesday, July 24, 2002 11:14
AM
Subject: Re: [TN] Need info on a
material
:)
I am
on the receiving end of this one, Rudy. We do not make the parts, but
are receiving them and we are wondering if this material is why we are having
solderability problems, i.e. it is not "getting out of the way" of the molten
solder front as it wets across the lead. When we take the parts and
sonicate them in IPA and then test them they do MUCH
better.
regards,
Bev
Christian
Research in Motion
Mr. Christian:
You called
sir?
You called it exactly, this juice is an OSP type
product.
When you have porous Gold plating on top of Nickle, any
exposed Nickle sets up a galvanic cell, and tends to oxidize/corrode more
quickly than if it were exposed without being in contact with Gold.
This stuff reacts with the exposed Nickle, and renders it less reactive...it
is actually a very elegant idea, because it will only react with exposed
Nickle (contrary to their website) thus the possibility of there being ANY
effect on conductivity is virtually nil.
Now, is this really an
issue? Am I missing an opportunity? I wouldn't want my fellow
Techneters to have to import this stuff from Japan...and I am always ready
to assist whenever I can.. I can already see the name....ONP
BC "Organic Nickle Protection....as suggested by Bev
Christian.
Rudy Sedlak
RD Chemical Company
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