i have a question about  the new families of MSD components we have recently been seeing.
There is now a new group of components being rated as Moisture Sensitive Devices, that are not IC's.  e.g.: LED's, Capacitors, etc....

Is the MSD level now becoming a Quality Level indicating the Quality or Reliability of the part instead of the vapor transmissiblity of the package to prevent the 'Popcorning' problem ?
Should i purchase a level 2 (non-IC) part from one mfgr, rather than a level 3 (non-IC) part from another because it has successfully passed the Level 2 MSD qualification tests ?
Are some (non-IC) manufacturers using the MSD Rating system to hide quality defects or inadequate high temperature construction materials ?
i would suggest that anyone having component failures of these new MS devices
perform detailed component failure analysis to see if there is a MS vapor transmission (popcorn) failure or some other high temperature failure mechanism (like reversion, epoxy degradation, or CTE problems).

This all could result in a new revision of MIL-HDBK-217 to add  'Pi sub MSD' factors.

Paul Signorelli
Sanmina-SCI

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