Folks,

   I am requesting assistance in locating reference material on
microvias/buried vias on component pads.
During a cross section of a BGA I am seeing a large solder void above a via.
Is this an acceptable process.

Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc:     512-725-3471
Pgr:     512-907-0005

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