"some young Design >Engineers don't take DFM seriously". if someone don't know "manufacturing", never set a foot into the manufacture floor, asking DFM is very un-reasonable. Send them to the floor for 6 month, you will see the difference. Send them to repair shop for another 6 month, you will get your DFR (design for reliability). In the process, you will get rid of the one who do not want to get their hands dirty too. jk ;-0 >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Ingemar Hernefjord >(EMW) >Sent: Tuesday, July 02, 2002 5:13 AM >To: [log in to unmask] >Subject: Re: [TN] FAULT/DEFECT TEST STRATEGY > > >So, so, don't weep dear Peter, >next line may comfort you a little >Production engineers are not included, what we mean are Design >Engineers...woe, woe...now I'll get that beeswarm on myself instead... >Like your humoristic spirit, Peter... > >Severily: DFM is like star of Betlehem, we too try to walk >steadily in that direction.Unfortunately, some young Design >Engineers don't take DFM seriously. > >Ingemar > > > > >-----Original Message----- >From: [log in to unmask] [mailto:[log in to unmask]] >Sent: den 2 juli 2002 10:11 >To: TechNet E-Mail Forum.; Ingemar Hernefjord (EMW) >Cc: [log in to unmask] >Subject: Re: [TN] FAULT/DEFECT TEST STRATEGY > > > >Dear Ingemar, > >I am deeply hurt! (sulk!) What's wrong with us Production Engineers, eh? We >have to make all this hardware so that it works, and it's important that we >have an input to board design. Maybe you're actually a wee Viking devil, >sitting on Earl's left shoulder, tempting him away from the true path of >DFM!? > >Peter > > > >"Ingemar Hernefjord (EMW)" <[log in to unmask]> >02/07/2002 02:49 PM >Sent by: TechNet <[log in to unmask]> > >Please respond to "TechNet E-Mail Forum."; Please respond to "Ingemar >Hernefjord (EMW)" > > To: [log in to unmask] > cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group) > Subject: Re: [TN] FAULT/DEFECT TEST STRATEGY > > > > > > > > >Hi Earl, >you seem to cover most in those few lines >I would add this first thing I did: use only highly skilled operators >(unless you see 'capabilities' below as human resources). Best guarantee, >better than good engineers....gosh...I'll be in bad situation now... >Best regards >Ingemar Hernefjord >PS. unwritten rule here : never let in an engineer in the production! Bit >of black humour, but with great deal of truth. > >-----Original Message----- >From: Earl Moon [mailto:[log in to unmask]] >Sent: den 1 juli 2002 19:14 >To: [log in to unmask] >Subject: [TN] FAULT/DEFECT TEST STRATEGY > > >Folks, > >I am not a test engineer but having to do catch up quickly to develop a >sensible test strategy to find faults and/or defects usin a combination of >test disciplines and elements. Watched my board designer spend a very long >time placing 1800 test points, some not on grid, as something of an >experiment on a non-HDI, but approaching it, and didn't like the results. > >I'm hoping some of you can offer positive, or negative, criticism >concerning >the following summary I've come up with though probably not new to you all: > >SUMMARY >When considering a new, fairly complex, high density PCB design (defined >often on the basis of how many and what pitch area array devices are >required) with limited test probe access for ICT, the following >considerations should be met: >1) Ensure only highly qualified board fabrication capabilities are used. >This must be done to provide printed circuitry that has the highest >laminate >integrity, hole quality and reliability, plated or coated surfaces that >solder wet, and the ability to do adequate bare board testing in >conjunction >with effective X-Sectional analysis. This will prevent many other defects >during the assembly operation as poor quality solder joints, and shorts or >opens when hole walls fail. >2) Ensure only highly qualified assembly capabilities are used. This must >be >done to provide defect free assemblies with high quality and reliability >solder joints, specified component placement and orientation, and the >ability to prove all this with a well thought out test strategy. >3) Ensure a well thought out test strategy is in place consisting of some >or >all the following: >? >X-Ray used on all area array devices to ensure high quality solder joints >and the ability to reduce the number of test probe pins and test points >relating to these device types. >? >AOI capabilities to determine solder joint quality for leaded and discrete >SMD?s as well as specified component types with proper orientations, >polarity, and values. This too will minimize the number of test points >required along with attendant bed of nails in those areas shown to meet >specified requirements. >? >The use of boundary scan in those circuit areas deemed viable for such >testing. >With all the above, it is possible to create and implement a test strategy >capable of providing for all test requirements for our board types but RF. >I >am studying a R/F test plan. > > >Earl Moon > >------------------------------------------------------------------- >-------------- > >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send e-mail to [log in to unmask]: >SET Technet NOMAIL >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/html/forum.htm for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >------------------------------------------------------------------- >-------------- > > >------------------------------------------------------------------- >-------------- > >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send e-mail to [log in to unmask]: >SET Technet NOMAIL >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/html/forum.htm for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >------------------------------------------------------------------- >-------------- > > > > > >[This e-mail is confidential and may also be privileged. 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Thank you.] > >------------------------------------------------------------------- >-------------- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/html/forum.htm for additional >information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >------------------------------------------------------------------- >-------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------