Hi Tony!

Here's a few links that describe the processes used to fill vias with conductive epoxy. I imagine that the eccobond material would use the same sort of process...but I could be wrong...

http://www.ipc.org/html/S17-4a.pdf

http://www.eagle-circuits.com/graphics/ViaInPads.pdf

http://www.circuitree.com/CDA/ArticleInformation/features/BNP__Features__Item/0,2133,72451,00.html

-Steve Gregory-



Can anyone tell me, or give me some insight on how to apply
Eccobond 56C to pad in via holes. I have contacted Emerson
& Cuming and they were not real responsive on details. Does anyone offer this service as an outside service?
Any info would be appreciated.

Tony Steinke
AIT-Atlanta Inc.


--------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------