Steve,
                I always have an interest on papers written on the ENIG
process or BLACK PAD.
            If possible can you share this PDF file with me and/or the
community.

            Victor,

 -----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Monday, July 22, 2002 11:21 AM
To: [log in to unmask]
Subject: Re: [TN] Au-Ni coating



I've never heard/read anything about uncured soldermask either. I've got a
pretty good *.PDF file authored by Nicholas Biunno of Hadco, and presented
at the '99 IPC Printed Circuits Expo that doesn't mention anything about
soldermask...is this something new?

-Steve Gregory-




Bruce:

My understanding of Black Pad was it is caused by too much phosphorus in the
nickel (as I recall) plating bath.
Solder mask contamination is a new one for me.
With mask going on after the gold, how does it contaminate the nickel? Mask
should not come in contact with the nickel at all in my experience

I am interested in learning all nuances of black pad causation.
Would appreciate your comments.

Charlie McMahon




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