Sasportas, Be very careful when using the " BLACK PAD " scenario. Audience can run with this information an make a mountain out of a mole hill. What is the suspected failing mode? How was this identified and/or confirm. If this is an ENIG process BGA, what reflow temp and how many were subjected. Reflow temps can lead to a thicker IMC region with nodules resulting in a marginal BGA strength. You will have to conduct BGA fault isolation and a series of analysis to pin point the failing mechanism. victor, -----Original Message----- From: Marki Sasportas [mailto:[log in to unmask]] Sent: Monday, July 22, 2002 7:04 AM To: [log in to unmask] Subject: [TN] Au-Ni coating Hello All, I have problem in BGA rework, In some cases after, heating specific zone on the board ( gold finish) A near BGA joints are being defected. After taking off this BGA I noticed that some of the pads are black, What can cause the problem? Thanks in advance, Sasportas Marki, CreoScitex Corporation Ltd. ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------