All, I am looking for information pertaining to standard specifications (IPC or such)regarding "peel strenght" of SMT solder joints. Specifically an SMT header connector. We are trying to perform a "pull test" but I read in an archived Technet message that suggested there was no such thing as a "pull test", instead refering to this method as a peel strenght test. However, I would like more information on this practice if anyone can assist. thank you, Steve Wormlight --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------