:)
I am on the receiving end of this one, Rudy.  We do not make the parts, but are receiving them and we are wondering if this material is why we are having solderability problems, i.e. it is not "getting out of the way" of the molten solder front as it wets across the lead.  When we take the parts and sonicate them in IPA and then test them they do MUCH better.
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Rudy Sedlak [mailto:[log in to unmask]]
Sent: July 24, 2002 11:57 AM
To: [log in to unmask]
Subject: Re: [TN] Need info on a material

Mr. Christian:

You called sir?

You called it exactly, this juice is an OSP type product.

When you have porous Gold plating on top of Nickle, any exposed Nickle sets up a galvanic cell, and tends to oxidize/corrode more quickly than if it were exposed without being in contact with Gold.  This stuff reacts with the exposed Nickle, and renders it less reactive...it is actually a very elegant idea, because it will only react with exposed Nickle (contrary to their website) thus the possibility of there being ANY effect on conductivity is virtually nil.

Now, is this really an issue?  Am I missing an opportunity?  I wouldn't want my fellow Techneters to have to import this stuff from Japan...and I am always ready to assist whenever I can..   I can already see the name....ONP BC  "Organic Nickle Protection....as suggested by Bev Christian.

Rudy Sedlak
RD Chemical Company
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