Hi all,

For one of our new products we are seeing a very high percentage of voids in
some of the BGA solder joints (just under 25% very close to IPC's maximum
allowable limit).  I have searched the technet archives trying to find
information on the causes and remedies on void formation but there is very
little detailed information on this subject.

Does anyone have or know of a document / web address were I could find some
detailed information on this subject.

Thanks,



Simon Howells
SMT Process Engineer
GPC Electronics Pty Ltd

Email:     mailto:[log in to unmask]
Web:  http://www.gpc.com.au

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