Hi all, For one of our new products we are seeing a very high percentage of voids in some of the BGA solder joints (just under 25% very close to IPC's maximum allowable limit). I have searched the technet archives trying to find information on the causes and remedies on void formation but there is very little detailed information on this subject. Does anyone have or know of a document / web address were I could find some detailed information on this subject. Thanks, Simon Howells SMT Process Engineer GPC Electronics Pty Ltd Email: mailto:[log in to unmask] Web: http://www.gpc.com.au --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------