On 15 Jul 2002 at 16:07, Don Larisey wrote: > I may have to do some designs with chip-on-board and I don't know > where to start. I have been doing some searching on the internet, but > I seem to be getting a lot of general stuff. I am looking for info > such as wire bond pad sizes, spacing, trace sizes, etc. And any other > info related to layout of COB. Regards, Don Try to contact the assembly house which is planned for the COB assembly on your boards - they can provide you with their own best proven design rules. For best success it is necessary to work closely together with the chip mfg., bare board mfg., the COB assembly house and, if it is not the same company, the SMT assembly house. Regards Matthias Mansfeld----------------------------------------------- Matthias Mansfeld Elektronik * Printed Circuit Board Design and Assembly Am Langhoelzl 11, D-85540 Haar, GERMANY Phone: +49-89-4620 0937, Fax: +49-89-4620 0938 E-Mail: [log in to unmask] Internet: http://www.mansfeld-elektronik.de --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------