I thought we had this all settled and the cause was in excess of 9% phosphorous in the plating solution. I'm a little behind it seems. Please excuse and help. I have at least 3 board shops proving to me on a regular basis they control the black pad issue. None in over 3 years now and excellent solderability as well. I thought the BGA voiding issue was settled too. Wasn't is supposed to be in the area of 20%? Additionally, I need a test engineer of the R/F variety for a contract to do what he/her does best. Looking at about 3 Ghz for transmit and receive and must be capable of writing and implementing an adequate test plan for our device/system. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------