I am looking for some way to place 12 mil solder balls on 50 mil pitch. Approximately 2500 balls on a substrate. I have some method to do so that is flux free, but the heat required is too great for my insulation material. Even a tool to place solder balls without use of flux or paste would help. I feel I could overcome the other obstacles. Either that, or I need an insulation/passivation material that is photoimagable and can withstand 500°C. Can anyone help?? Thank You, Dennis Fall Process Engineering Supervisor Thin Film Technology Corporation North Mankato, MN 56003-1702 Email: [log in to unmask] Phone: 507-625-8445 Fax: 507-386-9269 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------