Buried or embedded resistors and capacitors have been
shown on Roadmaps for many years, but the technology has not been user friendly
for board fabrication.
I am aware of the current work being
done by the NCMS, but what is not apparent is who would use these technologies
in their designs, what are the tolerances required, and how much are the CEMs/
OEMs prepared to pay the board fabs for this technology (I'm afraid the saving
they make on size and component purchase, inventory and placement will be offset
by an increase in PRICE of the raw card - it's called added
value).
Can anyone help me on this
?
Dougal Stewart