There are some guidelines in the fine Technet archives.

Dave Fish

----- Original Message -----
From: "Dave Snyder" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 07, 2002 2:48 PM
Subject: [TN] Glue or Not to Glue?


> When running SMT boards thru an IR reflow oven are there any guidelines,
IPC
> documents, gut feelings that tell whether gluing is necessary for parts
that
> would be on the bottom side during the top side reflow? I have at least
one
> 160 pin TQFP that would be on the bottom. Is there a formula like mass
> versus total pin area?
>
> Thanks in advance for the advice.
>
> Dave Snyder
> HM Electronics, Inc.
>
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information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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