This is done by utilising the fact that copper oxide has a slightly lower melting point than pure copper, so oxidised copper parts are run through a furnace at just over the oxide melting point and below the metal melting to "solder" the liquid copper oxide into the ceramic (usually aluminium oxide / alumina). The process was originally developed by GE so you could try there, or current suppliers like Kuramik in Germany, Toshiba and so on might be able to help you. Kind Regards Mike Fenner Applications Engineer, European Operations Indium Corporation T: + 44 1908 580 400 M: + 44 7810 526 317 F: + 44 1908 580 411 E: [log in to unmask] W: www.indium.com Leadfree: www.Pb-Free.com -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Dennis J. Fall Sent: Thursday, June 06, 2002 7:54 PM To: [log in to unmask] Subject: [TN] Direct copper bonding Where can I get more information on how to perform direct copper bonding to alumina? Thank You, Dennis Fall Process Engineering Supervisor Thin Film Technology Corporation North Mankato, MN 56003-1702 Email: [log in to unmask] Phone: 507-625-8445 Fax: 507-386-9269 ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------