Hi, Inge, could you let me know if you bonded on Ni-P or Ni (electrolytic?). thanks...jk >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Ingemar Hernefjord >(EMW) >Sent: Monday, June 24, 2002 8:51 AM >To: [log in to unmask] >Subject: Re: [TN] Wire bondable gold > > >Steve & Steve, >we have been wedgebonding directly on heavy nickelplated >aluminium plates without problem, large mass use to couple >mechanical waves better than weak materials that swing by. So, I >think too that it has to do with the gold structure, hardness or >temperature . First thing we use to do is using hard rubber or >scalpel blade, just to make sure we don't have some surface >contamination. Next, check workholder, both for temperature and >mechanical support. If there is a space between the object and the >workholder, ultrasonic mismatch can make bonding impossible. >Another annoying matter is sometimes that the insulator becomes to >soft, as Steve says, then you may have to try without preheat. I >assume you have the correct capillary and wire hardness for the job. > >Ingemar Hernefjord >Ericsson Microwave Systems > > > >-----Original Message----- >From: Creswick, Steven [mailto:[log in to unmask]] >Sent: den 24 juni 2002 12:05 >To: [log in to unmask] >Subject: Re: [TN] Wire bondable gold > > >Steve, > >I echo what Joe has already said. This amount of gold should not be a >problem for gold wire bonding unless the components have not attained >bonding temperature (on the order of 150C), or something is >moving/softening >during bonding. > >Even aluminum wire should bond well to this amount of gold - but >also as Joe >indicated, the long term reliability may be of some question. > >See if the Customer can share a bit more info with you as to the type of >bonding performed, temperatures, and the type of problems experienced. > >Steve Creswick - Gentex > >-----Original Message----- >From: Steve Kelly [mailto:[log in to unmask]] >Sent: Saturday, June 22, 2002 11:22 AM >To: [log in to unmask] >Subject: [TN] Wire bondable gold > > >We made some flex circuits for a customer and wound up putting too >much gold >on - approx. 75 microinches. The nickel is averaging 153. The gold >meets all >the purity specs. Under the wire bond area is a large heat sink. >My customer >is having difficulties wire bonding. Is too much gold a problem or can the >heat sink cause issues. Regards Steve Kelly >-------------------------- >Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net) > >------------------------------------------------------------------- >--------- >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send e-mail to >[log in to unmask]: SET >Technet NOMAIL >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/html/forum.htm for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >------------------------------------------------------------------- >--------- >----- > >------------------------------------------------------------------- >-------------- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/html/forum.htm for additional >information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >------------------------------------------------------------------- >-------------- > >------------------------------------------------------------------- >-------------- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/html/forum.htm for additional >information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >------------------------------------------------------------------- >-------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------