Ceramic absorts moisture and will likely "POP" during the thermal cycle. Bake the components ( ceramic cap) prior to wave solder. Look up IPC or JDECS standard for recommended time and temperature. "Kasprzak, Bill (sys) USX" To: [log in to unmask] <[log in to unmask] cc: OM> Subject: [TN] Wavesoldering Ceramic Caps Sent by: TechNet <[log in to unmask]> 06/18/2002 07:30 AM Please respond to "TechNet E-Mail Forum."; Please respond to "Kasprzak, Bill (sys) USX" Hello gang, We have a situation where a board design has some 2225 Ceramic Caps on the bottom side of the board. Most of the advisories I've seen indicates that wavesoldering these parts is not recommended. From what I can gather, thermal shock induces micro fractures within the ceramic substrate that leads to component failure. However, I'm thinking that if I could raise my normal wave preheat and lower my pot temperature, I could minimize the thermal shock. I could almost have a thermal profile that would be similar to reflow soldering. Reflow soldering of these ceramic caps, from what I've read, is OK. Some of the articles I've read on this cracking phenomenon were written in the late 80's, Is there any newer information out there? Is anyone out there routinely wave soldering these parts that could give me some pointers? We use an OA flux with a DI water wash in our process. As always your help is greatly appreciated. Bill Kasprzak Moog Inc. Manufacturing Engineering, Electronics --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------