Debbie Goodwin
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-----Original Message-----
From: David White [mailto:[log in to unmask]]
Sent: Friday, June 07, 2002 10:57 AM
To: [log in to unmask]
Subject: [TN] BGA packaging?
Technet,
I am quoting on a new asm that has several BGA's (256 ball count and up) + a couple of very large 25mil fine pitch processors. We have never dealt with these before. The question is do I need to get a waffle pack changer for my Siemens Siplace line? Or can I order these parts on tape and reel. I assume the fine pitch will have to be in tray form, but what about the BGA's? What is the industry standard?
Thanks
David
Ascom Energy Systems Inc.