Yes...John, We are using it in one of our prototypes.... Seen some failures in rework... the part doesn't seem to like the heat required to remove BGA's that are near to it... Recommend spacing it away from other BGA's that might affect it in re-work. The failed solder bonds inside the part melted allowing opens, looks like its a hybrid of some sort, or lumped elements inside after looking at the x-rays... We approximated the land pattern as closely as we could to their recommended pattern... seems to solder fine... good luck. - Bill Brooks -----Original Message----- From: Thorup, John [mailto:[log in to unmask]] Sent: Thursday, June 06, 2002 9:16 AM To: [log in to unmask] Subject: [TN] recommended land pattern I'm looking at this recommended pattern for a Dallas/Maxim BGA that's quite unlike anything I have seen before. http://pdfserv.maxim-ic.com/arpdf/DS32kHz.pdf This BGA has two columns of nine 25 mil eutectic balls at 50 mil pitch on either side of the package. The recommended pattern consists of 28 mil diamond shapes. Has anyone used this pattern? Comments? Thanks - John Thorup ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------