Hi Steve! Sorry but I have to disagree with you. SERA is a tool which can be used to extensively characterize a variety of surface finishes on printed wiring boards and any other surface that can be tested within the SERA equipment configuration limitations. I believe you may be confusing SERA with ECI's CVS instrumentation. The CVS equipment measures certain plating bath chemistry parameters. The SERA equipment is similar to Auger spectroscopy in analyzing surface finishes. Rockwell Collins has been successfully using SERA since 1991 in a wide variety of applications (keep in mind I'm a bit biased on this subject - Rockwell Collins was heavily involved in the development of the SERA equipment). Dave Hillman Rockwell Collins [log in to unmask] Steve Kelly <[log in to unmask]>@ipc.org> on 06/19/2002 01:13:02 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Steve Kelly <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: Re: [TN] Immersion Tin SERA will not help you - it is only a tool to measure tin /copper concentrations . We have been running immersion tin for 5 years with no issues but only one thermal excursion is allowed. The tin forms a copper/tin intermetallic after thermal. We even silkscreen before tin to eliminate this bake cycle. Regards Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Wednesday, June 19, 2002 12:07 PM To: [log in to unmask] Subject: Re: [TN] Immersion Tin Hi Tony, we experienced poor wave soldering after 2 reflows with immersion tin. So, please give me a few hints on SERA. Is it a test that the board house will do, or it has to be at our incoming? Does it imply additional charges? Where can I read more? Thanks, Ioan > -----Original Message----- > From: tony steinke [SMTP:[log in to unmask]] > Sent: Wednesday, June 19, 2002 11:19 AM > To: [log in to unmask] > Subject: Re: [TN] Immersion Tin > > Grant, > Having installed the Cookson(Dexter) FST chemistry a couple of years > ago at my previous employer, there are concerns that you should be aware > of. > The immersion tin > process is a beautiful thing if applied and processed properly. Some of > the > major > issues that I experienced were: > Solder mask adhesion(you should tape test any incoming product) > Request that SERA(sequential electromigration reduction analysis) test be > performed. > And the biggest problem was getting acceptable solderability on second > pass > wave solder > or second pass solder paste. The copper migration greatly accelerates > during > any thermal > excursion, but that is what the SERA testing will show you. > Tony Steinke > [log in to unmask] > > ----- Original Message ----- > From: "Grant Emandien" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Wednesday, June 19, 2002 3:06 AM > Subject: [TN] Immersion Tin > > > > Members, > > > > A PCB supplier has requested us to evaluate immersion tin as a finish. > > Immediate concerns raised were shelf life, solderability, whiskers, etc. > > Researching the archives has noted similar as well as opposing views and > > concerns. In addition to possible problems arising from immersion tin > > finish, what PCB fabricator process changes may contribute to possible > > reliability and solderability concerns and how this impacts production > > processes such as reflow. The proprietary chemistry used is MacStan HSR > from > > Macdermid. > > > > Anyone willing to share experiences and guide me towards making an > informed > > decision. > > > > TIA > > Grant > > > > > > ********************************************************************** > > Notice: > > > > This email transmission contains confidential information which is the > property of the sender. The information is intended only for the use of > the > addressee. If you are not the intended recipient, you are hereby notified > that any disclosure, copying or distribution of the contents of this > e-mail > transmission, or the taking of any action in reliance thereon or pursuant > thereto, is strictly prohibited. Should you have received this email in > error, please immediately notify us by telephone to arrange for return of > the documentation comprising this transmission. 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