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Gary,
I’ve heard
that it can have an effect, but I’ve not seen anything that shows a profound
difference. However, if you’re having
open traces on every hand soldered board, then I would believe that you
have some other issue going on.
Have you verified that your opens are with your plated thru-holes? Also, I recommend this question to TechNet.
William W. Gilman, CID
2827 Valley View Dr.
Knoxville, TN 37917
ph. 865-524-8679
fax 865-524-8679
cell 865-368-0665
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-----Original
Message-----
From: DesignerCouncil
[mailto:[log in to unmask]]On Behalf Of Bremer,
Gary
Sent: Monday, June 24, 2002 10:43
AM
To: [log in to unmask]
Subject: [DC] High Performance
Electronic Design
I am forwarding this question from one of
the design engineers at work. We advertise we build class 3 products, but
with all of our thick boards, we get open traces whenever a hand soldering
operation is required. We just found out that one of our board vendors
has been removing all the unused pads on the inner layers without out
knowledge. The board type we generally use for our backplanes is type 3c
per IPC-2222.
Does getting rid of unused pads on all
inner layers have any profound affect on the PHT barrel integrity especially
with high layer count / thick circuit boards?
Thanks for your help,
Gary Bremer
Manufacturing Engineer
Phone (626) 449-3090 ext. 219