I'd consider a BGA to fall under the surface mount spec. > ---------- > From: Ong Seet Leng[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Ong Seet Leng > Sent: Wednesday, June 26, 2002 3:23 AM > To: [log in to unmask] > Subject: [TN] Wrappage Percentage for printed boards with BGA and > micro BGA > > Hi, can someone guide me? In IPC-A-600F (2.11) it is stated as for printed > boards using surface mount components, the bow and twist shall be 0.75% or > less. For all other boards, bow and twist shall be 1.50% or less. > > 1. What I want to know is does the 0.75% include printed boards with > BGAs and micro BGAs? > > 2. If not, what is the bow and twist specification for boards with BGA > and micro BGA and from which IPC specifications that I will be able to > find them. > > I had briefly gone through IPC-7095 for BGAs as well as IPC-A-600F but > failed to locate any. > > NOTE: My company is using 1% of board length for bow and twist for > printed boards with surface mount components (BGAs and micro BGA included) > & plated through-holes type. > > Regards > > Seet Leng >