I'd consider a BGA to fall under the surface mount spec.

> ----------
> From:         Ong Seet Leng[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Ong Seet Leng
> Sent:         Wednesday, June 26, 2002 3:23 AM
> To:   [log in to unmask]
> Subject:      [TN] Wrappage Percentage for printed boards with BGA and
> micro BGA
>
> Hi, can someone guide me? In IPC-A-600F (2.11) it is stated as for printed
> boards using surface mount components, the bow and twist shall be 0.75% or
> less. For all other boards, bow and twist shall be 1.50% or less.
>
> 1.    What I want to know is does the 0.75% include printed boards with
> BGAs and micro BGAs?
>
> 2.    If not, what is the bow and twist specification for boards with BGA
> and micro BGA and from which IPC specifications that I will be able to
> find them.
>
> I had briefly gone through IPC-7095 for BGAs as well as IPC-A-600F but
> failed to locate any.
>
> NOTE:    My company is using 1% of board length for bow and twist for
> printed boards with surface mount components (BGAs and micro BGA included)
> & plated through-holes type.
>
> Regards
>
> Seet Leng
>