Steve, I also agree that the Au thickness is fine for Au wire but could be a reliability problem for Al. I have found that cooler temps (125C, even as low as 110C) for softer substrates (non-ceramic) usually perform more consistently when Au ball bonding. With Flex, getting proper clamping is very often an issue and I would certainly examine that possibility. Good Luck, Bruce Misner > ---------- > From: Steve Kelly[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Steve Kelly > Sent: Saturday, June 22, 2002 11:22 AM > To: [log in to unmask] > Subject: [TN] Wire bondable gold > > We made some flex circuits for a customer and wound up putting too much > gold on - approx. 75 microinches. The nickel is averaging 153. The gold > meets all the purity specs. Under the wire bond area is a large heat sink. > My customer is having difficulties wire bonding. Is too much gold a > problem or can the heat sink cause issues. Regards Steve Kelly > -------------------------- > Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net) > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: > SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- > ------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------