One of my co-workers has been
handed a 'reverse-engineering' project that was done by an outside contractor.
There are BGA's on this board that have had vias placed directly in the solder
land as well as many other SMD's with vias dropped in the solderable land area.
It has always been my
belief that this is not a
good "DFM" practice. Just wondering if anyone out there has had any
experience or information on
via-in-pad techniques - especially on BGA's.