Dear Technetters, I'm having some problems with really big voids (up to 50% of the diameter) in the solderjoints of BGA's. The problems occur on our only board that has via's in the BGA-pads. The via's are filled and plated, so from the outside you don't see they're there. I'm quite sure that it's the board that's causing the problems, but the boardvendor does not agree and thinks our solderpaste is causing it. To prove that I'm right (or to solve the problem if the boardvendor is right !) I'd like to do some tests with a solderpaste that's known to cause a minimal amount of voiding. From earlier discussions I learned that such solderpastes exist. Does anyone have a recommendation for such a solderpaste ? Daan Terstegge SMT Centre Thales Communications Unclassified mail Personal Website: http://www.smtinfo.net --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------