Hi all

The board CAN be reflowed, but the assembler told me that the vapor phase has a lot of advantages...

So i'm asking a third-part opinion..... I'd like to know the advantages and the disadvantages of the vapor phase compared to standard reflow.

Regards

Stefano

----- Original Message -----

From: [log in to unmask]>rgrant

To: [log in to unmask]>[log in to unmask]

Sent: Friday, May 24, 2002 7:55 PM

Subject: Re: [TN] Vapor phase

Hi Stefano,

Am I missing something? Why can't that board be reflowed using a standard convection reflow process?

-----Original Message-----
From: Stefano Riccardi [mailto:[log in to unmask]]
Sent: Friday, May 24, 2002 1:32 AM
To: [log in to unmask]
Subject: [TN] Vapor phase

Hi all!

We are currently looking for the assembling of a double side SMT - one side THT (High pin count connectors) board, with a lot of BGA.

An assembler proposed us the use of vapor Phase reflow soldering.

Any comment about this method?

Can someone tell me where I can find informations (books, www, publications) about the vapor phase soldering?

Thanks!