Ron.. I agree w/Mike on this one. The combinations have been and could be argued w/immesurable redundancy. Bottom line - There are no underlying issues which would dictate the use of one over the other. I would expect; however, that in your specific application you might even see a bit better wetting with the Sn63. Regards Jim Wertin Technical Applications Manager AIM, Inc. [log in to unmask] www.aimsolder.com ----- Original Message ----- From: "Automatic digest processor" <[log in to unmask]> To: "Recipients of TechNet digests" <[log in to unmask]> Sent: Monday, May 13, 2002 10:00 PM Subject: TechNet Digest - 12 May 2002 to 13 May 2002 (#2002-109) > There are 12 messages totalling 707 lines in this issue. > > Topics of the day: > > 1. 63/37 solder paste with silver plated boards > 2. Cleaning of No-clean Assemblies (2) > 3. ReA610HoleFill (3) > 4. IPC-4552 spec for ENIG (2) > 5. Recommended solder paste for a 6 layer double-sided board with CSP & BGA > packages > 6. Plant closures (3) > > -------------------------------------------------------------------------- ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > -------------------------------------------------------------------------- ------- > > ---------------------------------------------------------------------- > > Date: Mon, 13 May 2002 10:49:53 +0100 > From: Mike Fenner <[log in to unmask]> > Subject: Re: 63/37 solder paste with silver plated boards > > There are no real technical issues in this sense here, the alloys are > interchangeable. > As to why you use it, most people are like you. They do because they do. > I'll say no more - I do not want to re-start the great Sn63 vs. Sn62 debate. > > Kind Regards > > Mike Fenner > > Applications Engineer, European Operations > Indium Corporation > T: + 44 1908 580 400 > M: + 44 7810 526 317 > F: + 44 1908 580 411 > E: [log in to unmask] > W: www.indium.com > Leadfree: www.Pb-Free.com > > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Vandendolder, Ron > Sent: Thursday, May 09, 2002 6:27 PM > To: [log in to unmask] > Subject: [TN] 63/37 solder paste with silver plated boards > > > Dear Technetters, > > We would like to change from sn 62/pb/36/ag2 solder paste to standard tin > lead eutectic for silver plated boards. Does anyone know if there are any > issues with silver leaching that would force us to remain with the Ag paste. > We started using the Ag paste years ago and now no one remembers why. The > silver plating on the boards is very thin (immersion 3-8 micro inches). > > Regards, > > Ron VandenDolder > Telaxis Communications > > -------------------------------------------------------------------------- -- > ----- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- -- > ----- > > ------------------------------ > > Date: Mon, 13 May 2002 07:12:24 -0500 > From: [log in to unmask] > Subject: Re: Cleaning of No-clean Assemblies > > Is there any particular reason for using so many different fluxes types? > > > **Yes. We have 11 manufacturing sites. Some are acquired companies, some > are divisions that like to manufacture "their own way". So, historically, > we have always had a wide range of fluxes in our inventory. Our current > philosophy is to give our sites some manufacturing choices, and allow the > IEs to determine what flux or paste works best for their hardware. We are > slowly weeding the RMAs and the OAs out of the system. We have found that > giving our sites choices between equally valid materials works better than > ramming a single set of materials down everyone's throat. > > Doug Pauls > > ------------------------------ > > Date: Mon, 13 May 2002 08:32:58 -0400 > From: "Sauer, Steven T." <[log in to unmask]> > Subject: Re: ReA610HoleFill > > Jim, Guy, Nancy and others, > I respectfully submit the following: > If the intent for the 50% hole fill allowance (in regard to PTHs with > thermal or conductor planes) is to be limited to class 2 then the exception > should be listed directly under "Acceptable - Class 2" not under "Defect - > Class 3" on page 6-7 and table 6-2 should have a note that flags this > allowance for Class 2. > As we all know, it is impossible to clearly and concisely write with the > English language in such a manner that all readers will properly understand > the meaning or intent of the words that is or are being conveyed. > Having not participated in the IPC-A-610 meetings (as Guy referred to), I > and others do not have the luxury of understand the intent of certain > requirements -- all that is affored to us is the written words. > In this case, the intent may have been to limit the 50% hole fill > requirement to class 2 but the printed words do not support this beyond the > shadow of a doubt. > I will prepare a Standard Improvement Form for IPC-A-610C and forward to IPC > so the committee can fill more hours with antiquated prose about this > subject. > I on the other hand still believe that 50% hole fill on most class 3 > products will not cause a problem in terms of long term reliability even > under extreme conditions as apposed to reworking the solder connection. > This statement is made under the premise that a well defined, developed and > controlled process is utilized. > If there is any objective evidence that 50% hole fill is a problem, I along > with Sir Werner would like to review the data, hardware, photomicrographs, > cross-sections, etc. > > Steve Sauer > > ------------------------------ > > Date: Mon, 13 May 2002 08:52:38 -0400 > From: Debbie Schepis <[log in to unmask]> > Subject: IPC-4552 spec for ENIG > > Does anyone know the status of the IPC-4552 spec for ENIG? I thought I had > read in a previous post that it was due to be released this spring, but I > still can't find it when I search on the IPC web site. > > Thanks, > > Debbie > > ------------------------------ > > Date: Mon, 13 May 2002 09:18:31 EDT > From: George Milad <[log in to unmask]> > Subject: Re: IPC-4552 spec for ENIG > > --part1_c6.b750120.2a111727_boundary > Content-Type: text/plain; charset="US-ASCII" > Content-Transfer-Encoding: 7bit > > The specification IPC 4552 has been completed. > It is presently in final formating and will be sent out as a "Final Interim" > for final peer review. It is presently with Tom Newton Technical director at > IPC. > Best Regards > George Milad > HDI Consulting > Chairman IPC Plating Committee > > --part1_c6.b750120.2a111727_boundary > Content-Type: text/html; charset="US-ASCII" > Content-Transfer-Encoding: 7bit > > <HTML><FONT FACE=arial,helvetica><FONT SIZE=2>The specification IPC 4552 has been completed. > <BR>It is presently in final formating and will be sent out as a "Final Interim" for final peer review. It is presently with Tom Newton Technical director at IPC. > <BR>Best Regards > <BR>George Milad > <BR>HDI Consulting > <BR>Chairman IPC Plating Committee</FONT></HTML> > > --part1_c6.b750120.2a111727_boundary-- > > ------------------------------ > > Date: Mon, 13 May 2002 15:34:39 +0200 > From: "d. terstegge" <[log in to unmask]> > Subject: Re: Cleaning of No-clean Assemblies > > Hi Leland, > > If the post-solder residues can safely be left on the board a solder paste = > may already be referred to as "no-clean", in spite of the fact that many = > users still want to clean it because of improved pin-testability, = > conformal coating or esthetics. It is not uncommon that the same brochures = > that present a solderpaste as "no-clean" include a list of compatible = > cleaning chemistries, which you can use as a starting-point for your = > investigattions. > If your solderpaste is designed as a "no-clean-only" then you're in = > trouble, and you should consider changing the complete process including = > the paste. > > Daan Terstegge > SMT Centre > Thales Communications > Unclassified mail > Personal Website: http://www.smtinfo.net > > >>> Leland Woodall <[log in to unmask]> 05/08 9:41 pm >>> > Folks, > > We've been asked to investigate the pros and cons of performing an aqueous > wash of our no-clean assemblies prior to them receiving an acrylic = > conformal > coating. Our management team wants the product to be absolutely free from > any type of contamination. > > Has anyone had any experience with this? What are the possible advantages > and some of the pitfalls we could anticipate? > > Are there any knowledge sources that you might be able to recommend? > > Any assistance would be sincerely appreciated. > > Regards, > > Leland Woodall > Quality Coordinator > Keihin Carolina System Technology, Inc. > 4047 McNair Road > Tarboro, NC 27886 > > Phone: 252-212-1565, ext. 2865 > > -------------------------------------------------------------------------- -= > ------ > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: = > SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to Listserv@ip= > c.org: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives= > =20 > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 = > ext.5315 > -------------------------------------------------------------------------- -= > ------ > > ------------------------------ > > Date: Mon, 13 May 2002 10:12:36 -0400 > From: Francis Sun <[log in to unmask]> > Subject: Recommended solder paste for a 6 layer double-sided board with CSP & > BGA packages > > Hi, > > I would appreciate any recommendation and/or feedback on solderpaste for a > 6 layer double-sided board with CSP & BGA packages. > The smallest aperture size is 0.014 inch dia. for the CSP. > TIA. > > > Regards; > > Frank Sun > IVHS > (905) 624-3025 ext. 1235 > Fax: (905) 624-4572 > > ------------------------------ > > Date: Mon, 13 May 2002 09:43:20 -0500 > From: Jack Crawford <[log in to unmask]> > Subject: Re: ReA610HoleFill > > This is a MIME message. If you are reading this text, you may want to > consider changing to a mail reader or gateway that understands how to > properly handle MIME multipart messages. > > --=_5D00B307.CBAAC83A > Content-Type: text/plain; charset=US-ASCII > Content-Transfer-Encoding: quoted-printable > > Steve, no need for the Std Improvement Form for this now--I'll take a copy = > of this message when I leave Wed afternoon for committee meetings this = > week; DPMO 9261/7912 here in Northbrook tomorrow and Wed, then A-620 = > Thurs/Fri; A-610 Sat/Sun and HDBK-610 Monday. All meetings in Hunt Valley, = > MD, graciously hosted by Teresa Rowe at AAI this time. No additional = > meetings scheduled at this time but Greg Hurst, BAE Systems, Austin TX and = > Mel Parrish, Soldering Technology International and Vernon Judy, Qualastat = > Electronics, Gettysburg PA have invited the committees to meetings at = > their facilities. > Cordially > Jack > > >>> [log in to unmask] 05/13/02 07:32AM >>> > Jim, Guy, Nancy and others, > I respectfully submit the following: > If the intent for the 50% hole fill allowance (in regard to PTHs with > thermal or conductor planes) is to be limited to class 2 then the = > exception > should be listed directly under "Acceptable - Class 2" not under "Defect - > Class 3" on page 6-7 and table 6-2 should have a note that flags this > allowance for Class 2. > As we all know, it is impossible to clearly and concisely write with the > English language in such a manner that all readers will properly understand= > > the meaning or intent of the words that is or are being conveyed. > Having not participated in the IPC-A-610 meetings (as Guy referred to), I > and others do not have the luxury of understand the intent of certain > requirements -- all that is affored to us is the written words. > In this case, the intent may have been to limit the 50% hole fill > requirement to class 2 but the printed words do not support this beyond = > the > shadow of a doubt. > I will prepare a Standard Improvement Form for IPC-A-610C and forward to = > IPC > so the committee can fill more hours with antiquated prose about this > subject. > I on the other hand still believe that 50% hole fill on most class 3 > products will not cause a problem in terms of long term reliability even > under extreme conditions as apposed to reworking the solder connection. > This statement is made under the premise that a well defined, developed = > and > controlled process is utilized. > If there is any objective evidence that 50% hole fill is a problem, I = > along > with Sir Werner would like to review the data, hardware, photomicrographs, > cross-sections, etc. > > Steve Sauer > > -------------------------------------------------------------------------- -= > ------ > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: = > SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to Listserv@ip= > c.org: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 = > ext.5315 > -------------------------------------------------------------------------- -= > ------ > > --=_5D00B307.CBAAC83A > Content-Type: text/html; charset=ISO-8859-1 > Content-Transfer-Encoding: quoted-printable > Content-Description: HTML > > <!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN"> > <HTML><HEAD> > <META http-equiv=3DContent-Type content=3D"text/html; charset=3Diso-8859-1"= > > > <META content=3D"MSHTML 5.50.4134.600" name=3DGENERATOR></HEAD> > <BODY style=3D"MARGIN-TOP: 2px; FONT: 8pt MS Sans Serif; MARGIN-LEFT: = > 2px"> > <DIV><FONT size=3D1></FONT>Steve, no need for the Std Improvement Form for = > this=20 > now--I'll take a copy of this message when I leave Wed afternoon = > for=20 > committee meetings this week; DPMO 9261/7912 here in Northbrook tomorrow = > and=20 > Wed, then A-620 Thurs/Fri; A-610 Sat/Sun and HDBK-610 Monday. All meetings = > in=20 > Hunt Valley, MD, graciously hosted by Teresa Rowe at AAI this time. No=20 > additional meetings scheduled at this time but Greg Hurst, BAE Systems, = > Austin=20 > TX and Mel Parrish, Soldering Technology International and Vernon Judy,=20 > Qualastat Electronics, Gettysburg PA have invited the committees = > to=20 > meetings at their facilities.<BR>Cordially</DIV> > <DIV>Jack</DIV> > <DIV> </DIV> > <DIV>>>> [log in to unmask] 05/13/02 07:32AM >>><BR>Jim, = > Guy,=20 > Nancy and others,<BR>I respectfully submit the following:<BR>If the intent = > for=20 > the 50% hole fill allowance (in regard to PTHs with<BR>thermal or = > conductor=20 > planes) is to be limited to class 2 then the exception<BR>should be = > listed=20 > directly under "Acceptable - Class 2" not under "Defect -<BR>Class 3" on = > page=20 > 6-7 and table 6-2 should have a note that flags this<BR>allowance for = > Class=20 > 2.<BR>As we all know, it is impossible to clearly and concisely write = > with=20 > the<BR>English language in such a manner that all readers will properly=20 > understand<BR>the meaning or intent of the words that is or are being=20 > conveyed.<BR>Having not participated in the IPC-A-610 meetings (as = > Guy =20 > referred to), I<BR>and others do not have the luxury of understand the = > intent of=20 > certain<BR>requirements -- all that is affored to us is the written = > words.<BR>In=20 > this case, the intent may have been to limit the 50% hole fill<BR>requireme= > nt to=20 > class 2 but the printed words do not support this beyond the<BR>shadow of = > a=20 > doubt.<BR>I will prepare a Standard Improvement Form for IPC-A-610C and = > forward=20 > to IPC<BR>so the committee can fill more hours with antiquated prose = > about=20 > this<BR>subject.<BR>I on the other hand still believe that 50% hole fill = > on most=20 > class 3<BR>products will not cause a problem in terms of long term = > reliability=20 > even<BR>under extreme conditions as apposed to reworking the solder=20 > connection.<BR>This statement is made under the premise that a well = > defined,=20 > developed and<BR>controlled process is utilized.<BR>If there is any = > objective=20 > evidence that 50% hole fill is a problem, I along<BR>with Sir Werner would = > like=20 > to review the data, hardware, photomicrographs,<BR>cross-sections,=20 > etc.<BR><BR>Steve=20 > Sauer<BR><BR>--------------------------------------------------------------= > -------------------<BR>Technet=20 > Mail List provided as a free service by IPC using LISTSERV 1.8d<BR>To=20 > unsubscribe, send a message to [log in to unmask] with following text = > in<BR>the=20 > BODY (NOT the subject field): SIGNOFF Technet<BR>To temporarily halt = > delivery of=20 > Technet send e-mail to [log in to unmask]: SET Technet NOMAIL<BR>To receive = > ONE=20 > mailing per day of all the posts: send e-mail to [log in to unmask]: SET = > Technet=20 > Digest<BR>Search the archives of previous posts at: <A=20 > href=3D"http://listserv.ipc.org/archives">http://listserv.ipc.org/archives<= > /A><BR>Please=20 > visit IPC web site <A=20 > href=3D"http://www.ipc.org/html/forum.htm">http://www.ipc.org/html/forum.ht= > m</A>=20 > for additional<BR>information, or contact Keach Sasamori at [log in to unmask] = > or=20 > 847-509-9700=20 > ext.5315<BR>---------------------------------------------------------------= > ------------------<BR></DIV></BODY></HTML> > > --=_5D00B307.CBAAC83A-- > > ------------------------------ > > Date: Mon, 13 May 2002 09:47:17 -0500 > From: Mel Parrish <[log in to unmask]> > Subject: Re: ReA610HoleFill > > Steve, > Thanks for the input to the standard. > This was a very hotly contested issue with the last revision to the standard > (610C). In synopsis, concern for PTH reliability was in regard to thermal > shock conditions based upon some old documentation that I'm sure you are > aware of, and input from companies that had experienced failures. The > advancement of standards and allowances for PTH robustness may serve to > cause new concerns and personally I've seen renewed issues concerning PTH > reliability as a performance limitation. It would be useful to run some new > tests using newer PWB technologies and see what the outcome and impact is > today. > I echo your concern for rework of PTH solder connections and even worse vias > that have solder fill. Remember that the consideration to rework is a last > resort and a drastic measure and certainly only one of the options available > for consideration according to the IPC standards. We should not arbitrarily > rework product without consideration for outcome based upon reliability and > product performance. Other options are available under Disposition. > > > Mel Parrish > Director of Training > Soldering Technology International > 102 Tribble Drive > Madison, AL 35758 > 256 705 5530 > 256 705 5538 Fax > [log in to unmask] > www.solderingtech.com > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Sauer, Steven T. > Sent: Monday, May 13, 2002 7:33 AM > To: [log in to unmask] > Subject: Re: [TN] ReA610HoleFill > > > Jim, Guy, Nancy and others, > I respectfully submit the following: > If the intent for the 50% hole fill allowance (in regard to PTHs with > thermal or conductor planes) is to be limited to class 2 then the exception > should be listed directly under "Acceptable - Class 2" not under "Defect - > Class 3" on page 6-7 and table 6-2 should have a note that flags this > allowance for Class 2. > As we all know, it is impossible to clearly and concisely write with the > English language in such a manner that all readers will properly understand > the meaning or intent of the words that is or are being conveyed. > Having not participated in the IPC-A-610 meetings (as Guy referred to), I > and others do not have the luxury of understand the intent of certain > requirements -- all that is affored to us is the written words. > In this case, the intent may have been to limit the 50% hole fill > requirement to class 2 but the printed words do not support this beyond the > shadow of a doubt. > I will prepare a Standard Improvement Form for IPC-A-610C and forward to IPC > so the committee can fill more hours with antiquated prose about this > subject. > I on the other hand still believe that 50% hole fill on most class 3 > products will not cause a problem in terms of long term reliability even > under extreme conditions as apposed to reworking the solder connection. > This statement is made under the premise that a well defined, developed and > controlled process is utilized. > If there is any objective evidence that 50% hole fill is a problem, I along > with Sir Werner would like to review the data, hardware, photomicrographs, > cross-sections, etc. > > Steve Sauer > > -------------------------------------------------------------------------- -- > ----- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- -- > ----- > > ------------------------------ > > Date: Sat, 27 Apr 2002 12:27:20 -0400 > From: Scott Westheimer <[log in to unmask]> > Subject: Plant closures > > This is a multi-part message in MIME format. > > ------=_NextPart_000_0007_01C1EDE6.E0850700 > Content-Type: text/plain; > charset="iso-8859-1" > Content-Transfer-Encoding: quoted-printable > > Looking for some help. I need to put a together a report on the health = > of the PCB industry and was wonder if some of you know how many PCB = > shops have either closed or have down sized. Any help would be = > appreciated. > > Scott B. Westheimer > General Manager,=20 > Gultech North Carolina > 5800 McHines Place > Raleigh, North Carolina 27616 > Phone: (919)872-0100 > Fax: (919)713-4849 > Cell: (919)649-1510 > [log in to unmask] > > ------=_NextPart_000_0007_01C1EDE6.E0850700 > Content-Type: text/html; > charset="iso-8859-1" > Content-Transfer-Encoding: quoted-printable > > <!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN"> > <HTML><HEAD> > <META http-equiv=3DContent-Type content=3D"text/html; = > charset=3Diso-8859-1"> > <META content=3D"MSHTML 6.00.2715.400" name=3DGENERATOR> > <STYLE></STYLE> > </HEAD> > <BODY bgColor=3D#ffffff> > <DIV><FONT face=3DArial size=3D2>Looking for some help. I need to put a = > together a=20 > report on the health of the PCB industry and was wonder if some of = > you=20 > know how many PCB shops have either closed or have down sized. Any help = > would be=20 > appreciated.</FONT></DIV> > <DIV> </DIV> > <DIV><FONT face=3DArial size=3D2>Scott B. Westheimer<BR>General Manager, = > <BR>Gultech=20 > North Carolina<BR>5800 McHines Place<BR>Raleigh, North Carolina = > 27616<BR>Phone:=20 > (919)872-0100<BR>Fax: (919)713-4849<BR>Cell: (919)649-1510<BR><A=20 > href=3D"mailto:[log in to unmask]">[log in to unmask]</A></= > FONT></DIV></BODY></HTML> > > ------=_NextPart_000_0007_01C1EDE6.E0850700-- > > ------------------------------ > > Date: Mon, 13 May 2002 12:48:56 EDT > From: Joe Fjelstad <[log in to unmask]> > Subject: Re: Plant closures > > --part1_d7.177a3645.2a114878_boundary > Content-Type: text/plain; charset="US-ASCII" > Content-Transfer-Encoding: 7bit > > Contact Fred Friedman or Harvey Miller at Fabfile > > Harvey can be reached at [log in to unmask] > > You may also wish to contact Walt Custer (www.custerconsulting.com) > > > > --part1_d7.177a3645.2a114878_boundary > Content-Type: text/html; charset="US-ASCII" > Content-Transfer-Encoding: 7bit > > <HTML><FONT FACE=arial,helvetica><FONT SIZE=2>Contact Fred Friedman or Harvey Miller at Fabfile > <BR> > <BR>Harvey can be reached at [log in to unmask] > <BR> > <BR>You may also wish to contact Walt Custer (www.custerconsulting.com) > <BR> > <BR></FONT></HTML> > > --part1_d7.177a3645.2a114878_boundary-- > > ------------------------------ > > Date: Mon, 13 May 2002 14:32:00 -0400 > From: "WEEKES, MICHAEL HS-SNS" <[log in to unmask]> > Subject: Re: Plant closures > > This message is in MIME format. Since your mail reader does not understand > this format, some or all of this message may not be legible. > > ------_=_NextPart_001_01C1FAAC.78604AE0 > Content-Type: text/plain; > charset="iso-8859-1" > > the upcoming TMRC may be of use or the report from there. > > -----Original Message----- > From: Scott Westheimer [mailto:[log in to unmask]] > Sent: Saturday, April 27, 2002 11:27 AM > To: [log in to unmask] > Subject: [TN] Plant closures > > > Looking for some help. I need to put a together a report on the health of > the PCB industry and was wonder if some of you know how many PCB shops have > either closed or have down sized. Any help would be appreciated. > > Scott B. Westheimer > General Manager, > Gultech North Carolina > 5800 McHines Place > Raleigh, North Carolina 27616 > Phone: (919)872-0100 > Fax: (919)713-4849 > Cell: (919)649-1510 > [log in to unmask] <mailto:[log in to unmask]> > > > ------_=_NextPart_001_01C1FAAC.78604AE0 > Content-Type: text/html; > charset="iso-8859-1" > > <!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN"> > <HTML><HEAD> > <META HTTP-EQUIV="Content-Type" CONTENT="text/html; charset=iso-8859-1"> > > > <META content="MSHTML 5.50.4616.200" name=GENERATOR> > <STYLE></STYLE> > </HEAD> > <BODY bgColor=#ffffff> > <DIV><SPAN class=843323218-13052002><FONT face=Arial color=#0000ff size=2>the > upcoming TMRC may be of use or the report from there.</FONT></SPAN></DIV> > <BLOCKQUOTE dir=ltr style="MARGIN-RIGHT: 0px"> > <DIV class=OutlookMessageHeader dir=ltr align=left><FONT face=Tahoma > size=2>-----Original Message-----<BR><B>From:</B> Scott Westheimer > [mailto:[log in to unmask]]<BR><B>Sent:</B> Saturday, April 27, 2002 > 11:27 AM<BR><B>To:</B> [log in to unmask]<BR><B>Subject:</B> [TN] Plant > closures<BR><BR></FONT></DIV> > <DIV><FONT face=Arial size=2>Looking for some help. I need to put a together a > report on the health of the PCB industry and was wonder if some of you > know how many PCB shops have either closed or have down sized. Any help would > be appreciated.</FONT></DIV> > <DIV> </DIV> > <DIV><FONT face=Arial size=2>Scott B. Westheimer<BR>General Manager, > <BR>Gultech North Carolina<BR>5800 McHines Place<BR>Raleigh, North Carolina > 27616<BR>Phone: (919)872-0100<BR>Fax: (919)713-4849<BR>Cell: > (919)649-1510<BR><A > href="mailto:[log in to unmask]">[log in to unmask]</A></FONT> </DIV></BLOCKQUOTE></BODY></HTML> > > ------_=_NextPart_001_01C1FAAC.78604AE0-- > > ------------------------------ > > End of TechNet Digest - 12 May 2002 to 13 May 2002 (#2002-109) > ************************************************************** > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------