Leland, What you request can and is being done by many of our customers - automotive groups in particular. However, as you learned from the other respondents, this is not a simple exercise - but then what is? To help, and without knowing your end application, I suggest that you consider new SIR test methods as a "Process Characterisation" protocol. The principal (but not unique) issues, relate to electro-chemical reactions of an unpredictable nature. Viz: flux residues can harbour unwanted ionic and non-ionic residues that may harm the circuit when it subsequently exposed to humidity that can render them mobile - dendrites / intermetallic growths that commonly result in premature circuit failure. By taking representative coupons of your end assembly, and processing them in sequence with your final product and exposing them to the same process chemistries, you will be better able to determine the potential reliability of your end product. What happens in production is usually somewhat less controlled than tests done in the lab. If you would like to see sight of a draft specification of this, let me know off line, and I will attach the relevant stuff for your consideration. You might like to talk to some test labs: CSL - Pacific Labs - TRACE Labs - Robisan and many others that you can trawl from the TechNet archives. These folks can do the testing for you, and we can assist with the test parameters...that differ considerably from the old and out-of-date methods currently used to characterise process materials. Regards Graham Naisbitt [log in to unmask] <mailto:[log in to unmask]> Concoat ANNOUNCE their acquisition of the former Multicore SPCID business. MUST II Solderability Testing Systems - CM Cleanliness Testing Systems - Auto-SIR Reliability Testing Systems - SoldaPro & NEW SoldaPro Wizard Thermal Profilers For more information please visit our new web site: www.concoatsystems.com <http://www.concoatsystems.com> Concoat Limited Alasan House, Albany Park Camberley GU16 7PH - UK www.concoat.co.uk <http://www.concoat.co.uk> Phone: +44 1276 691100 Fax: +44 1276 691227 Mobile: +44 79 6858 2121 > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall > Sent: Wednesday, May 08, 2002 20:42 > To: [log in to unmask] > Subject: [TN] Cleaning of No-clean Assemblies > > > Folks, > > We've been asked to investigate the pros and cons of > performing an aqueous wash of our no-clean assemblies prior > to them receiving an acrylic conformal coating. Our > management team wants the product to be absolutely free from > any type of contamination. > > Has anyone had any experience with this? What are the > possible advantages and some of the pitfalls we could anticipate? > > Are there any knowledge sources that you might be able to recommend? > > Any assistance would be sincerely appreciated. > > Regards, > > Leland Woodall > Quality Coordinator > Keihin Carolina System Technology, Inc. > 4047 McNair Road > Tarboro, NC 27886 > > Phone: 252-212-1565, ext. 2865 > > -------------------------------------------------------------- > ------------------- > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8d To unsubscribe, send a message to > [log in to unmask] with following text in the BODY (NOT the > subject field): SIGNOFF Technet To temporarily halt delivery > of Technet send e-mail to [log in to unmask]: SET Technet > NOMAIL To receive ONE mailing per day of all the posts: send > e-mail to [log in to unmask]: SET Technet Digest Search the > archives of previous posts at: > http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------