Earl, When is a connector determined to be "high density" type? David A. Douthit Manager LoCan LLC Earl Moon wrote: > May I ask of you all your familiarity with this operation. I am not a > Sanmina fan going way back with Jure and Milan in the '80's. I've just lost > interest in their Hadco capability that used to be top notch. The following > was recently read in Jeff's fine rag: > > Sanmina-SCI Announces High Density Flexible Circuit Capability > PR Newswire (May 2, 2002) > > SAN JOSE, Calif., May 2, 2002 /PRNewswire-FirstCall via COMTEX/ -- > Sanmina-SCI Corporation (Nasdaq: SANM), a leading global electronics > contract manufacturer and high performance printed circuit board (PCB) > fabricator, today announced it is producing high density interconnect (HDI) > multi-layer flexible printed circuit boards at its HDI manufacturing and > research center in Costa Mesa, California. Multi-layer flexible circuits > allow for very high wiring densities on very thin boards which can then be > bent or folded to fit into tight spaces. The additional capability supports > customer requirements for leading edge, cost-effective technology for high > performance products. > > George Dudnikov, Sanmina-SCI's Senior Vice President and Chief Technology > Officer for Printed Circuit Board Fabrication, said, "The 100,000 square > foot Costa Mesa facility, one of the most advanced PCB factories in the > world, is designed with the specialized infrastructure necessary for > manufacturing the highest complexity HDI products. Virtually > all-manufacturing operations are performed within a 40,000 square foot > general Class 10,000 clean room environment. Class 1000 and 100 > environments, similar to the type available in semiconductor fabs, are used > for critical process steps such as photolithography, circuit formation and > plating. Sanmina-SCI is the only PCB manufacturer in North America to have > such an extensive level clean room facility. This infrastructure, which is > paramount to obtaining high yields when manufacturing high density, > ultra-fine line products, supports our opto-electronic PCB research and > development efforts." > > Commenting further, Dudnikov said, "One of the key enabling technologies of > the Costa Mesa factory is the ability to handle thin polyimide or LCP > (liquid crystal polymer) film cores down to 25 microns (1 mil) in thickness. > Additional capabilities include vacuum sputtered metal deposition of seed > chrome and copper, laser-formed blind and buried vias down to 50-micron > diameter, and buried passive components (resistors and capacitors) utilizing > patented technologies. Circuit features can be as low as 25-micron (.001") > trace widths. Semiconductor packaging type processes include flip chip and > gold wire bond assembly technologies. Many of the company's Costa Mesa > customers are focusing on new product applications for the high performance > medical, opto-electronic, and wireless RF module markets." > > Jim Ryan, Vice President and General Manager of the Cost Mesa factory, said, > "We are pleased with the interest we are seeing in our advanced capabilities > for HDI product, especially in HDI flex products. As a result, many of our > new product programs are very technically complex and cannot easily be moved > offshore for production. In addition because of our ability to provide > finished PCBs and flex circuits with ultra low surface ionics, we are > successfully supporting our medical assembly operation. Our business is also > expanding due to the increase in chip on flex (COF) requirements and our > multiple gold finish capabilities for wire bonding. We also plan on > broadening our capabilities into rigid flex products for medical > applications and military avionics." > > Who's 100,000 sq foot facility was this and how many people going this way, > please? > > MoonMan > > --------------------------------------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------