Mike It's true that PFCs do dissolve oxygen but the quantity in the vapour phase is sufficiently low that no significant oxidation will occur, unlike non-controlled atmospheric convection or IR soldering. Milder/less flux can be used. The advantage over convection is that 3-D assmeblies are much easier to solder and, being asymptotic, the process is less liable to damage components which are very thermally sensitive because it is impossible to exceed the vapour temperature which is fixed by the chemical composition. Brian > Stefano Riccardi wrote: > > Hi all! > We are currently looking for the assembling of a double side SMT - one > side THT (High pin count connectors) board, with a lot of BGA. > An assembler proposed us the use of vapor Phase reflow soldering. > Any comment about this method? > Can someone tell me where I can find informations (books, www, > publications) about the vapor phase soldering? > > Thanks! --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------