I expect to see a fillet that complies with the requirements for a bottom only termination. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Reid, Lorraine > Sent: Thursday, May 23, 2002 7:41 AM > To: [log in to unmask] > Subject: [TN] D2PAK devices > > > Can the learned people at Technet please advise on solder > acceptance guidelines for D2PAK devices? > > Obviously the pair of leads (at what I will call the front edge > of the device) are treated as any leaded device in respect of > the acceptability criteria of IPC-A-610, but what should the > "plate" at the back be treated as? > > We have a situation where the pad design is just undersize for > the component to be fitted - if we allow the front leads to > overhang their pads, then we would accept this as "toe overhang" > which does not violate minimum electrical clearance, but I am > unsure as to what set of guidelines best applies to the lead at > the rear of the device. > > I hope I have explained this OK. > > thanks > > Lorraine Reid --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------