Hi, I am looking for a Rigid printed circuit board reliability model that is more recent than the MIL-217 or AT&T model. It would include factors for blind and buried vias as well as soldered and unsoldered through holes and surface mount solder joints. Usually there is also a board complexity factor based on the number of layers. Any suggestions on where to look would be appreciated. Jim Lamb --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------