I'm curious, has anyone seen the solder brightness become dull after reflow when switching from HASL on the board finish to gold immersion? Any idea how to correct for it? -Bill -----Original Message----- From: Furrow, Robert Gordon (Bob) [mailto:[log in to unmask]] Sent: Thursday, May 09, 2002 10:59 AM To: [log in to unmask] Subject: Re: [TN] 63/37 solder paste with silver plated boards Ron, We routinely use eutectic tin lead solder paste with immersion silver finished boards with no negative effects. The silver dissolves into the molten solder pretty uniformly and the concentration is so low as to not be relevant. The tin/copper intermetallic formation is essentially the same as with HASL or OSP boards. Thanks, Robert Furrow Printed Wiring Board Engineer Supply Chain Networks Lucent Technologies 978-960-3224 [log in to unmask] -----Original Message----- From: Vandendolder, Ron [mailto:[log in to unmask]] Sent: Thursday, May 09, 2002 1:27 PM To: [log in to unmask] Subject: [TN] 63/37 solder paste with silver plated boards Dear Technetters, We would like to change from sn 62/pb/36/ag2 solder paste to standard tin lead eutectic for silver plated boards. Does anyone know if there are any issues with silver leaching that would force us to remain with the Ag paste. We started using the Ag paste years ago and now no one remembers why. The silver plating on the boards is very thin (immersion 3-8 micro inches). Regards, Ron VandenDolder Telaxis Communications ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------